When fully cured the adhesive will have excellent performance at elevated temperatures and has high chemical resistance. It is suitable for bonding a wide variety of metals, ceramics, glass, rubbers, rigid plastics and other materials, and is widely used in many industrial applications where resistance to aggressive or warm environments are required. The low out gassing makes this product suitable for specialist electronic telecommunication and aerospace applications.
Low out gassing / volatile loss
Excellent chemical resistance
Temperature resistant to 120C
Cures at temperatures down to 5C
Thixotropic, gap filling paste